next generation integrated circuit Market Types, Applications, Products, Share, Growth, Insights and Forecasts Report 2030

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The Next Generation Integrated Circuit market report discusses in detail the growth opportunities, challenges, market drivers and restraints, limitations, threats, and demands of the market. The study further assesses the regional market as well as the international market to garner an insight into the scope of the market. The report also provides deeper insights into the technological advancements, industrial landscape, and emerging product and technological developments in the Next Generation Integrated Circuit market. It offers fruitful insights into the business sphere to help businesses capitalize on the lucrative growth opportunities.

The next generation integrated circuit is a type of integrated circuit made of advanced materials and components, to improve energy efficiency, convenience, security features, and functionalities. Very-large scale integration, for example, reduces the size of circuits, increases cost-effectiveness of devices, and improves performance in terms of circuit operating speed. These benefits increase the reliability of next-generation integrated circuits and make them an ideal component for a variety of electronic appliances.

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Further key findings from the report suggest

  • In January 2022, Navitas Semiconductor, the industry leader in Gallium Nitride (GaN) power integrated circuits, announced the establishment of a new electric vehicle design center as part of its continued expansion into higher power GaN market. Compared to legacy silicon solutions, GaN-based onboard chargers are expected to charge three times faster and save up to 70% of energy.
  • Mixed-signal integrated circuit segment accounted for a significantly large revenue share in 2020. Majority of industries acknowledge the benefits of using mixed-signal integrated circuits, which help in improving reliability, lowering initial costs, and reducing power usage. This has resulted in high preference for mixed-signal integrated circuits among end-use industries, which is expected to drive revenue growth of this segment.
  • Surface mount packaging segment accounted for a significantly large revenue share in 2020, due to greater preference for surface mount packaging and advantages provided by it, such as reduced component size, increased component density, and improved mechanical performance under shock and vibration conditions. Furthermore, lower initial cost, as well as simple and quick automated assembly, make it a popular choice among end users.

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Report Objective:

The report offers a complete analysis of the global next generation integrated circuit market with details about each market player including company profile, financial standing, global position, revenue contribution, production and manufacturing capacity, business expansion plans, and new product launches. Key players are strategizing various plans such as M&A acquisition, partnerships, joint ventures, license agreement and collaborations. Allied Electronics & Automation, DERF Electronics Corp., Mouser Electronics, Inc., Infineon Technologies AG, Skyworks Solutions, Inc., Analog Devices, Inc., Achronix Semiconductor Corporation, Bourns, Inc., Macronix International Co., Ltd., and TDK-Micronas GmbH. and others are some of the top companies profiled in the report.

The report also covers the scope of individual applications and types in each region. The report also covers details about production and consumption patterns, technological developments, revenue growth, market size, market share, key trends and demands influencing market growth in the region, and robust presence of key players in the region.

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Emergen Research has segmented the global next generation integrated circuit market on the basis of product type, technique, number of components, package, application, and region:

  • Product Type Outlook (Revenue, USD Million; 2018–2030)
    • Digital Integrated Circuit
    • Analog Integrated Circuit
    • Mixed-Signal Integrated Circuit
  • Technique Outlook (Revenue, USD Million; 2018–2030)
    • Thin and Thick Film Integrated Circuit
    • Monolithic Integrated Circuit
    • Hybrid or multichip Integrated Circuit
  • Number of Components Outlook (Revenue, USD Million; 2018–2030)
    • Small-scale Integration
    • Medium-scale Integration
    • Large-scale Integration
    • Very Large-scale Integration
    • Ultra Large-scale Integration
  • Package Outlook (Revenue, USD Million; 2018–2030)
    • Through-Hole Mount Packages
    • Surface Mount Packaging
  • Application Outlook (Revenue, USD Million; 2018–2030)
    • Automotive
    • Healthcare
    • Consumer Electronics
    • Others

Regional segmentation comprises of a current and forecast estimation of the market in the key geographical regions such as North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

The report addresses the following key points:

  • The report provides a forecast of market drivers, restraints, and future opportunities for the next generation integrated circuit market
  • The report further analyses the changing market dynamics
  • Regional analysis and segmentation of the market with analysis of the regions and segments expected to dominate the market growth
  • Extensive competitive landscape mapping with profiles of the key competitors
  • In-depth analysis of business strategies and collaborations such as mergers and acquisitions adopted by the key companies
  • Revenue forecast, country scope, application insights, and product insights

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